Biswas, K., Liu, S.G. and Zhang, X.W. (2008) Effects of detailed substrate modeling and solder layout design on the 1st and 2nd level solder joint reliability for the large die FCBGA. International Conference on Thermal, Mechanical and Nultiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, Freiburg im Breisgau, 20-23 April 2008, 1-7.

不同焊料对微盘腔半导体激光器散热的影响
Effect of Different Solders on Heat Dissi-pation of Micro-Disk Cavity Semiconductor Laser

刘 云, 晏长岭, 杨静航, 逄 超, 冯 源, 郝永芹, 李 辉, 徐东昕, 张剑家    科研立项经费支持

应用物理Vol.9 No.2, 全文下载: PDF HTML XML DOI:10.12677/APP.2019.92010, February 19 2019

MEMS半填充微型气相色谱柱微流道设计及流场研究
Microfluidic Channel Design and Flow Field Study of MEMS Semi-Packed Micro Gas Chromatography Columns

陈宗帅, 胡 州   

建模与仿真Vol.13 No.2, 全文下载: PDF HTML XML DOI:10.12677/MOS.2024.132134, March 22 2024

NCM622三元动力电池热失控蔓延抑制的实验与建模研究
Experimental and Modeling Study on Thermal Runaway Propagation Inhibition in NCM622 Ternary Lithium-Ion Batteries

陈蔚靖    国家自然科学基金支持

建模与仿真Vol.13 No.1, 全文下载: PDF HTML XML DOI:10.12677/MOS.2024.131044, January 19 2024

叶片圆形尾缘对微型轴流风扇气动噪声的影响
Effects of the Circular Trailing Edge on the Aerodynamic Noise of the Micro Axial Flow Fan

许浩东, 赛庆毅, 辛旭超, 刘 勇, 吴林泉   

建模与仿真Vol.10 No.4, 全文下载: PDF HTML XML DOI:10.12677/MOS.2021.104103, November 22 2021

无铅焊料的电迁移效应及规避
Electromigration in Lead-Free Solder and Its Avoidance

蒋积超, 凌玉梅, 杨文超, 湛永钟    科研立项经费支持

自然科学Vol.1 No.1, 全文下载: PDF HTML XML DOI:10.12677/ojns.2013.11001, May 24 2013

微型山坡地形对风电场性能的影响研究
Study of the Effect of Micro-Hillside Topography on Wind Farm Performance

杨 号, 陈 建   

建模与仿真Vol.12 No.5, 全文下载: PDF HTML XML DOI:10.12677/MOS.2023.125395, September 5 2023