K. Biswas, S. G. Liu and X. W. Zhang. Effects of detailed substrate modeling and solder layout design on the 1st and 2nd level solder joint reliability for the large die FCBGA. IEEE In- ternational Conference on Thermal, Mechanical and Nultiphy- sics Simulation and Experiments in Micro-Electronics and Micro- Systems, 2008: 1-7.

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Effect of Different Solders on Heat Dissi-pation of Micro-Disk Cavity Semiconductor Laser

刘 云, 晏长岭, 杨静航, 逄 超, 冯 源, 郝永芹, 李 辉, 徐东昕, 张剑家    科研立项经费支持

应用物理Vol.9 No.2, 全文下载: PDF HTML XML DOI:10.12677/APP.2019.92010, February 19 2019

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Experimental and Modeling Study on Thermal Runaway Propagation Inhibition in NCM622 Ternary Lithium-Ion Batteries

陈蔚靖    国家自然科学基金支持

建模与仿真Vol.13 No.1, 全文下载: PDF HTML XML DOI:10.12677/MOS.2024.131044, January 19 2024

MEMS半填充微型气相色谱柱微流道设计及流场研究
Microfluidic Channel Design and Flow Field Study of MEMS Semi-Packed Micro Gas Chromatography Columns

陈宗帅, 胡 州   

建模与仿真Vol.13 No.2, 全文下载: PDF HTML XML DOI:10.12677/MOS.2024.132134, March 22 2024

叶片圆形尾缘对微型轴流风扇气动噪声的影响
Effects of the Circular Trailing Edge on the Aerodynamic Noise of the Micro Axial Flow Fan

许浩东, 赛庆毅, 辛旭超, 刘 勇, 吴林泉   

建模与仿真Vol.10 No.4, 全文下载: PDF HTML XML DOI:10.12677/MOS.2021.104103, November 22 2021

无铅焊料的电迁移效应及规避
Electromigration in Lead-Free Solder and Its Avoidance

蒋积超, 凌玉梅, 杨文超, 湛永钟    科研立项经费支持

自然科学Vol.1 No.1, 全文下载: PDF HTML XML DOI:10.12677/ojns.2013.11001, May 24 2013

散热强化型覆晶球栅数组封装组合体内的凸块之疲劳寿命研究
Investigation of Fatigue Life of Solder Bumps in a Thermally Enhanced FC-PBGA Assembly

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应用物理Vol.2 No.1, 全文下载: PDF HTML DOI:10.12677/app.2012.21004, January 18 2012