L. Chen, Q. Zang. The effects of underfill and its material mo- dels on thermomechanical behaviers of a flip chip package. IEEE Transactions on Advanced Packaging, 2001, 24(1): 17-24.

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材料科学Vol.15 No.1, 全文下载: PDF XML DOI:10.12677/ms.2025.151018, January 30 2025

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Generalized $\left(n\times m,\left\{3,5\right\},1\right)$ Perfect Difference Families and Related Geometric Orthogonal Codes

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理论数学Vol.14 No.7, 全文下载: PDF XML DOI:10.12677/pm.2024.147266, July 11 2024