《Journal of Applied Physics》

Mechanism of Ohmic Behavior of Al/Ti Contacts to p-Type 4H-SiC after Annealing

作者:
BJ JohnsonMA Capano

关键词:
Metal-nonmetal contactsKinetics of defect formation and annealingStructure of clean surfacesTransmission electron microscopy

摘要:
We report on experiments to determine the mechanism of ohmic behavior of Al/Ti contacts to p-type SiC after thermal annealing. After ruling out heavy doping of the SiC surface due to diffusion of aluminum, and electric field enhancement due to surface morphology modification, we propose that the only remaining explanation is alloy formation at the metal鈥搒emiconductor interface. We present evidence from x-ray diffraction studies identifying these alloys as Ti 3 SiC 2 and Al 4 C 3 , and review corroborating transmission electron microscopy studies. An alloy-assisted ohmic contact mechanism is presented and discussed.

在线下载

相关文章:
在线客服:
对外合作:
联系方式:400-6379-560
投诉建议:feedback@hanspub.org
客服号

人工客服,优惠资讯,稿件咨询
公众号

科技前沿与学术知识分享