薄膜与基体间的界面滑移破坏

Failure Analysis on Interfacial Slipping in a Film/Substrate Structure

摘要: 薄膜/基体结构是常用于柔性电子与热障涂层的一种基本结构。就这种结构而言，当薄膜非常薄的时候，实验研究中会发现其界面破坏模式与宏观尺度下的情况具有显著不同，即出现了一种新的界面破坏模式，滑移破坏。本文针对试验现象建立了界面滑移破坏模型，得到能量释放率、应力强度因子。对试验现象进行分析，与实验数据进行比较，并在此基础上研究了能量释放率、应力强度因子等随薄膜基体厚度比的变化关系。理论分析结果可以较好解释实验现象，从而用于指导柔性电子器件的结构设计。

Abstract: As far as the basic structure of thin film/substrate commonly used in flexible electronic devices and thermal barrier coatings is concerned, when the film is very thin, it can be found that the failure modes of interface in a film/ substrate structure are significantly different from those of macroscopic scale, namely, a new interface failure, slipping failure, which is observed in experiment research. Considering this phenomenon, the failure model of interfacial slip- ping is provided. Analysis is performed to obtain the energy release rates and stress intensity factors to study the failure mechanism of this structure. The relationships between energy release rates, stress intensity factors and film-substrate thickness ratio are studied. Theoretical results coincide well with the experimental phenomena. Thus, the present solu- tions can be used in structure design of flexible electronics.