基本情况

田修波,哈尔滨工业大学教授、博士生导师。

 

主要经历

2003  1 月 教授,哈尔滨工业大学

2002 年底作为引进人才回哈工大工作

2002 年 博士,香港城市大学

1999-2002 年 香港城大物理及材料科学系博士,其间两次赴美国加州大学、伯克莱分校劳伦斯国家实验室进行合作研究,有着较多的国际合作。多次赴美国、德国、法国、加拿大、日本等国参加国际会议

1998 年赴香港城市大学合作研究

1996 年从事等离子体表面改性研究工作

1993-1995 年哈工大 现代焊接生产技术国家重点实验室 ,研究功率超声波设备

1995  7 月 讲师

1993 年 哈工大硕士

1990 年 哈工大材料学院学士

 

研究领域

等离子体放电及其表面功能化应用:脉冲电源、太阳能薄膜技术、连接与封接、表面工程(生物、耐磨、耐蚀、抗氧化等等)、等离子体数值仿真等。

 

论文发表

  1. X. B. Tian, Z. M. Zeng, B. Y. Tang, K. Y. Fu, D. T. K. Kwok, and P. K. Chu, “Properties of titanium nitride fabricated on stainless steel by plasma-based ion implantation/deposition”, Mater. Sci. Eng., A, vol. 282, pp. 164 - 169 (2000).
  2. X. B. Tian, Z. M. Zeng, T. Zhang. B. Y. Tang, and P. K. Chu, “Medium temperature plasma immersion ion implantation of austenitic stainless steel”, Thin Solid Films, vol. 366, no. 1 - 2, pp. 150 - 154 (2000).
  3. X. B. Tian and P. K. Chu, “Direct temperature monitoring for semiconductors in plasma immersion ion implantation”, Rev. Sci. Instrum., vol. 71, no. 7, pp. 2839 - 2842 (2000).
  4. X. B. Tian, Z. M. Zeng, B. Y. Tang, T. K. Kwok, and P. K. Chu, “Fast plasma immersion ion implantation for tribolgical applications”, Surf. Coat. Technol., vol. 128 - 129, pp. 226 - 230 (2000).
  5. X. B. Tian, Z. M. Zeng, X. C. Zeng, B. Y. Tang, and P. K. Chu, “Efficacy of high-frequency, low-volatge plasma immersion ion implantation of bar-shaped target”, J. Appl. Phys., vol. 88, no. 5, pp. 2221 - 2225 (2000).
  6. X. B. Tian and P. K. Chu, “Electrochemical corrosion properties of AISI 304 steel treated by low-temperature plasma immersion ion implantation”, Scripta Mater., vol. 43, no. 5, pp. 417 - 422 (2000).
  7. X. B. Tian, D. T. K. Kwok, and P. K. Chu, “Modeling of incident particle energy distribution in plasma immersion ion implanattion”, J. Appl. Phys. vol. 88, no. 9, pp. 4961 - 4966 (2000).
  8. X. B. Tian and P. K. Chu, “Modeling of the relationship between implantation parameters and implantation dose during plasma immersion ion implantation”, Phys. Lett., A, vol. 277, pp. 42 - 46 (2000).
  9. X. B. Tian, L. P. Wang, D. T. K. Kwok, B. Y. Tang, and P. K. Chu, “Capacitance of high-voltage coaxial cable in plasma immersion ion implantation”, J. Mater. Sci. Technol., vol. 17, no. 1, pp. 41 - 42 (2001).
  10. X. B. Tian, Y. X. Leng, T. K. Kwok, L. P. Wang, B. Y. Tang, and P. K. Chu, “Hybrid elevated temperature, low / high-volatge plasma immersion ion implantation of AISI 304 stainless steel”, Surf. Coat. Technol., vol. 135, no. 2 - 3, pp. 178 - 183 (2001).
  11.  X. B. Tian and P. K. Chu, “Experimental investigation of the electrical characteristics and iniation dynamics of pulsed high-volatge glow-discharge”, J. Phys. D: Appl. Phys., vol. 34, no. 3, pp. 354 - 359 (2001).
  12. X. B. Tian, R. K. Y. Fu, and P. K. Chu, “Effects of bias voltage on the corrosion resistance of titanium nitride thin films fabricated by dynamic plasma immersion ion implantation”, J. Vac. Sci. Technol., A, vol. 20, no. 1. pp. 160 - 164 (2002).
  13. X. B. Tian, S. C. H. Kwok, L. P. Wang, and P. K. Chu, “Corrosion-resistance of AISI 304 stainless steel treated by hybrid elevated-temperature, low-voltage/ high-voltage nitrogen plasma immersion ion implantation”, Mater. Sci. Eng. A, vol. 326, no. 2., pp. 348 - 354 (2002).
  14.  X. B. Tian, R. K. Y. Fu, J. Y. Chen, P. K. Chu, and I. G. Brown, “Charging of Dielectric Substrate Materials during Plasma Immersion Ion Implantation”, Nucl. Instrum. Meth. B vol. 187, no. 4, pp. 485 - 491 (2002).
  15. X. B. Tian, D. T. K. Kwok, P. K. Chu, and A. Anders, “Two-Dimensional Sample Temperature Modeling in Separation by Plasma Implantation of Oxygen (SPIMOX) Process”, IEEE Trans. Plasma Sci. vol. 30, no. 1, pp. 423 - 427 (2002).
  16.  X. B. Tian, L. P. Wang, R. K. Y. Fu, and P. K. Chu, “Bias Voltage Influence on Surface Morphology of Titanium Nitride Synthesized by Dynamic Nitrogen and Titanium Plasma Immersion Ion Implantation and Deposition”, Mater. Sci. Eng. A vol. 337, no. 1 - 2, pp. 236 - 240 (2002).
  17. X. B. Tian, P. Peng, and P. K. Chu, “Enhancement of Process Efficacy Using Seed Plasma in Pulsed High-Voltage Glow Discharge Plasma Implantation”, Physics Letters A vol. 303, no. 1, pp. 67 - 71 (2002).
  18. X. B. Tian, T. Zhang, R. K. Y. Fu, and P. K. Chu, “Influence of Bias Voltage on the Tribological Properties of Titanium Nitride Films Fabricated by Dynamic Plasma Ion Implantation / Deposition”, Surface & Coatings Technology. vol. 161, no. 2 - 3, pp. 232 - 236 (2002).